HMC606

供应商:

描述: 宽带低相位噪声放大器芯片,2 - 18 GHz

物料参数

Gain dB (typ):12.5dB
OP1dB (typ):13dBm
NF (typ):6.5dB
OIP3 (typ):22dBm
Vs (typ):5V
Is (typ):64mA
Package:CHIPS OR DIE
Product Lifecycle:量产
# of Channels:1
Automotive:No
Temp Range:-55 to 85°C
EP:No
Specified at Freq:None
Package Height:None
Design Tools:None
Launch Date:None
Gain dB (max):None
Gain dB (min):None
Package Area:None
Vs+ (max):None
Vs+ (min):None
Eval / Ref Circuit:None
Reliability Level:None
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